Daniel Ezekiel
Angestellt, Vice President (Semiconductor Cluster), Deutsche Telekom
Bonn, Deutschland
Über mich
I am a technology and business leader, and I am passionate about transforming and scaling business by driving technology innovations in the semiconductor and software industry. I have a demonstrated track record of success in business development, engineering, product/technology management, and marketing. I have led global teams both in large MNCs and in startups, in direct and matrix structures. I cultivate strategic partnerships and build cross-functional teams to deliver technology solutions that promote business growth and profitability. My products/solutions have consistently penetrated new markets and delivered new business opportunities adding to substantial revenue growth. I bring together technology, products and marketing. I thrive in global settings, having lived in 6 countries and having had the pleasure of working with 10+ different nationalities. Detailed Profile@ https://www.linkedin.com/in/danielezekiel/
Werdegang
Berufserfahrung von Daniel Ezekiel
Bis heute 6 Monate, seit Jan. 2024
Vice President (Semiconductor Cluster)
Deutsche Telekom
Defining and executing Semiconductor strategy. Driving Technology Leadership to enhance Telekom' market position and competitive advantage. ReImagining the Network. Connecting Everyone !
3 Jahre, Jan. 2021 - Dez. 2023
Global Director, Business Development (Smart Cities & Transportation)
Intel Deutschland GmbHLead the global Transportation (Marine) IOT business, comprised of a cross functional team (sales, technical and business) Responsible for P&L $25+M,revenue & growth, team growth Responsible for the inception and execution of Transportation Labs at Karlsruhe, Germany Work with policy teams, global standard bodies & EU org. A trusted advisor for the customers Thought-leader and keynote presenter at global events, Mentor role for Intel Ignite and Startup Incubation programs
Led the EMEA Telecom-Operators management and connected cellular PC business development Directed strategic partnerships, introduced new channel strategy, marketing programs, GTM strategy Established thought-leadership and developed pilot programs and go-to-market strategies utilizing operators and OEMs Operators drove the TAM to beyond 5%, based on the hybrid GTM programs Collaborated with Cellular operators across EMEA to align LTE/5G roadmap, features, and business strategy
1 Jahr und 7 Monate, Sep. 2016 - März 2018
Senior Manager, Product planning and Marketing
Intel Deutschland GmbH Developed sensor hub and soft sensing intellectual property (IP), as well as coordinated sensor ecosystem calibration. Established sensor technology solutions utilized in automotive infotainment, robotics, advanced augmented and virtual reality, and smart home and connected devices.
3 Jahre und 11 Monate, Okt. 2012 - Aug. 2016
Senior Manager
INTEL
Senior Manager
1 Jahr und 1 Monat, Sep. 2011 - Sep. 2012
Technology Manager (Chipset)
Nokia
Technology Manager Responsible for Chipset Roadmap, contributed to the chipset strategy of the mid-range Nokia phones o Technical and business evaluation of chipset vendors o Drove technical requirements from the chipset vendors o Maintained the metrics benchmarks for Engines performance parameters o Features and requirements alignment across CTO, Marketing teams, Portfolio planning o BOM costs modeling, business case estimation
2 Jahre und 4 Monate, Juni 2009 - Sep. 2011
Product Family Manager
Nokia
Product Family Manager Responsible for feature specification of Rich feature phones based on market requirements, competitor analysis, and Nokia hardware/software capabilities o Maintained Device families for the Rich feature phones o Evaluated operator feature requests, technical marketing requests, competitor features, Nokia HW/SW capabilities and driving the relevant requirements into product plans o Supplier interaction for chipsets, and some additional components for Technical requirements, c
9 Monate, Okt. 2008 - Juni 2009
Engine Project Lead
Nokia
Engine Project Leader Productization of new Chipsets & Engines o Responsible for Engine SW delivery in a team setup across 5 sites and 1 external supplier o Demonstrated the first S40 Digital TV by managing the drivers adaptation, contribution to the SW architecture, test system setup and supplier engineering interaction o Involved in the “Hybrid Touch” innovation project
2 Jahre und 2 Monate, Aug. 2006 - Sep. 2008
Technical Leader
Nokia
Team Leader DSP RF o Set up DSP RF group from scratch and delivered for 3 chipsets o Established GERAN DSP RF capabilities in Bangalore o Brought in key talent into the Layer 1 team across various groups o Initiated and Facilitated in-placement in Nokia during downsizing of CSR
1 Jahr und 11 Monate, Okt. 2004 - Aug. 2006
Team Leader
Texas Instruments
Team Leader Layer 1 MCU Development o Led Layer 1 MCU team for Locosto, the 1st Digital Radio Processor based engine o Managed customization for Motorola Acoustics program o Proposed architectural improvements for the next generation eDRP o Enhanced host based tool for low level RF and HW debugging
3 Monate, Juli 2004 - Sep. 2004
Technical Leader
Kodiak Networks
Technical Leader o Managed delivery of Push to Talk Solution for 6 customers across 4 continents
2 Jahre und 3 Monate, Apr. 2002 - Juni 2004
Technical Leader
CSR
o Led the team responsible for L23 “Access Stratum” (post camping on procedures ), during the development of Multimode GGAS Stack o Managed Engineering deliveries for the 1st Customer (APSI)
3 Jahre und 9 Monate, Juli 1998 - März 2002
Senior Design Engineer
Sasken Communications Limited
Worked in roles from Software Engineer to Senior Software Engineer to Technical Lead o Designed and developed SW for the CDMA Base Station (Nortel) , TD-SCDMA (Thales) Test harness development o Developed software project proposals
Sprachen
Englisch
Muttersprache
Deutsch
Gut
Tamil
Fließend