Gatik Kalra
Angestellt, Development Engineer, Capgemini Engineering
Abschluss: Masters, Technische Universität Chemnitz
Reutlingen, Deutschland
Über mich
Product Engineer | Driving Innovation and Optimising Product Development Through Electromechanical Engineering
Werdegang
Berufserfahrung von Gatik Kalra
Bis heute 1 Jahr und 3 Monate, seit Apr. 2023
Development Engineer
Capgemini Engineering
• Optimization of sensor systems at Bosch eBike systems, Reutlingen • Tools / skills: Business mindset, Finite Element Analysis Sensor-system optimization, Scripting, Automation
3 Jahre und 6 Monate, Juli 2019 - Dez. 2022
Research and Development Scientist
KIT - Karlsruhe Institute of Technology
• Developed portable magnet for Electron Paramagnetic Resonance (EPR) spectroscopy and its characterization setup using 3-axial motorized stage • Designed and fabricated Micro-fluidics for CMOS based ASIC • Tools / skills: Clean room, FEA, Validation, Magnetics, Programming, CAD modeling, Project management, Wire Bonding, Automation, Micromachining (Glass/Polymer Structures)
1 Jahr und 2 Monate, Apr. 2018 - Mai 2019
Research Assistant
Fraunhofer IMWS
• Structural analysis of honeycomb Core Sandwich Structures • Tools / Skills: FEA, Validation, mechanical testing, Scripting
2 Jahre und 10 Monate, Juni 2015 - März 2018
Student Assistant
Technify Motors GmbH
• Used Lathe and CNC machines, Documented measured results, processed crankshafts, camshafts, and high-pressure pump parts • Tools / Skills: Production processes, Quality control, and Documentation
7 Monate, Feb. 2014 - Aug. 2014
Technical Consultant
ManpowerGroup
• Maintenance of telecom connectivity at Ericsson India Global Services Pvt Ltd, Noida, India • Tools / Skills: telecom services, Connectivity management
Ausbildung von Gatik Kalra
4 Jahre und 2 Monate, Okt. 2014 - Nov. 2018
Micro and Nanosystems
Technische Universität Chemnitz
• Master Thesis: Honeycomb Core Sandwich Structures at Fraunhofer IMWS, focusing on FEA and Mechanical Testing (Compression, Shear, and Three Point Bending). • Research Project: Investigated Relaxation Analysis of Thin Metal Films on Si Substrate at TU Chemnitz, involving Clean Room operations, SEM, FIB, FEA, and Digital Image Correlation (DIC). • Semiconductor Technology • Clean Room Processes • Microsystems Design (FEA of MEMS structures) • Reliability of Microsystems (Failure Analysis)
4 Jahre, Sep. 2009 - Aug. 2013
Electronics and Communication Engineering
Maharshi Dayanand University
• Internship: testing of DC power systems at Exicom Tele-Systems Ltd., Gurugram, India (6 months) • Internship: application of sensors and electromechanical switches for heavy automotive machinery at Honeywell Automation, Gurugram, India (2 months) • Circuit Designing • Mobile and Satellite communication • Information Technology • Embedded Systems (with C)
Sprachen
Englisch
Muttersprache
Deutsch
Fließend
Hindi
Muttersprache