Mario Schima
Angestellt, Fertigungs- & Testtechnologe, Preh Car Connect GmbH
Dresden, Deutschland
Werdegang
Berufserfahrung von Mario Schima
Responsible for 'Test Technologie' within the department 'Industrialization'
1 Jahr und 7 Monate, Okt. 2015 - Apr. 2017
International Field Application Engineer
GÖPEL electronic GmbH develop and deploy inline x-ray/optical inspection machines service intl. customer base (US, CN, EU)
2 Jahre und 11 Monate, Feb. 2012 - Dez. 2014
Scientist: electrical wafer test and automated optical inspection
Fraunhofer IZM-ASSID
Develop temporary wafer bonding and debonding technologies, Wafer test / electrical characterization, Automated optical inspection, ^^on 300mm wafer and mostly in 3D
Develop sensor packages and required manufacturing technology for high volume production in Malaysia, Transfer technology and supervise ramp up in Malaysia, Supervise electrical/optical final test in Dresden,
8 Jahre, Sep. 2002 - Aug. 2010
Development Engineer
Microelectronic Packaging Dresden GmbH
Development of 100W high power LED module, Development of RFID based smart label solution for environmental data logging, build individual component tracing systems,
1 Jahr, Aug. 2007 - Juli 2008
Internship / Industrial attachment
Memstech SenzPak Sdn Bhd - Malaysia, Memstech SensFab Pte Ltd - Singapore
Trainee program, Supervise thermopile assembly, Initiate and coordinate projects between production side in Malaysia and research / planning in Germany
Ausbildung von Mario Schima
7 Jahre und 3 Monate, Okt. 2002 - Dez. 2009
Electrical Engineering
TU-Dresden
Precision and Micro Engineering
Sprachen
Englisch
Fließend
Deutsch
Muttersprache