Miha Karlovsek
Bis 2011, Program of Telecommunications, Faculty of Electrical Engineering, University of Ljubljana
Ljubljana, Slowenien
Über mich
Highly skilled and knowledgeable in PCB design and related to IPC standards. Expert in Siemens Mentor Xpedition. Detail-oriented, self-starter, and excellent team player. Achieve realistic milestones.
Werdegang
Berufserfahrung von Miha Karlovsek
Bis heute 2 Jahre und 1 Monat, seit Juni 2022
Senior PCB Layout Designer (CAD Engineer)
Aviat Networks
-Creation and release of documentation for PCB Fabrication and Assembly. -Implementing the latest DFM and DFT techniques to produce designs that are not vendor-dependent, high-quality, high-yield, and low cost. -Responsible for the schematic IN/OUT, ensuring standards are met and consistency is maintained. -Assist in maintaining standard working practices through the regular review and updating of the PCB Design Team policy and procedures documentation. -Managing PCB CAD tools and licenses.
2 Jahre und 11 Monate, Aug. 2019 - Juni 2022
PCB Layout Designer (CAD Engineer)
Aviat Networks
-Design of high-density, multi-layer, digital and analog PCBs. -Determination of layer stack-up for RF and HS. -Routing techniques for DDR3/4, SERDES, RGMII, and FPGA re-pinning for minimal crossover. -Library symbol creation, managing the library database of parts. -Using Siemens software (formerly Mentor Graphics) Expedition PCB layout tool. -In-depth knowledge and completed Special Mentor Training of “FPGA IO Optimization” and “Constraint Management”. Skills: Siemens Mentor Expedition
- PCB design engineer of multilayer PCBs (FR4, IMS, Flex), - Supervise & support PCB development team members, - Capacity and resource management, - Cost reduction, Design-to-cost activities, - Employee training. Other: - Workplace health promoter, - Patent Coordinator in the field of electronics, - In charge of working procedures (Stages), - Lecture, education at the Faculty of Electrical Engineering (PCB thermal optimization)
- Multilayer designs of FR4, IMS and FLEX PCBs, - Electronics for ECU (BCM), DLP, Matrix manager layouts, - Lighting electronics for headlamps, single-function lamps and interior lighting (CCS, DC-DC, uC), - Feasibility studies based on thermal optimization and EMC compatibility, - Database for deploying data (SAP, PDM, PLM), - Employee of the year in 2014. Skills: EMC PCB solution · Cadence Allegro · Automotive · Thermal optimization
Ausbildung von Miha Karlovsek
5 Jahre und 9 Monate, Okt. 2005 - Juni 2011
Program of Telecommunications
Faculty of Electrical Engineering, University of Ljubljana
Evaluation of the degree: 10, First place in the competition for the best business idea CRMG, Participation at the Ljubljana University Incubator.
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Englisch
Fließend
Deutsch
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