Nikhil Kulkarni
Angestellt, Physical Design Engineer, Mirafra Software Technology Pvt. Ltd.
Bengaluru, Indien
Werdegang
Berufserfahrung von Nikhil Kulkarni
Bis heute 2 Monate, seit Mai 2024
Physical Design Engineer
Mirafra Software Technology Pvt. Ltd.
3 Jahre und 6 Monate, Nov. 2020 - Apr. 2024
Sr. Test and Validation Engineer
Synopsys India Pvt. Ltd.
5 Monate, Juni 2023 - Okt. 2023
Physical Design Engineer
Tessolve Semiconductor Pvt. Ltd.
6 Monate, Sep. 2022 - Feb. 2023
Design Engineer
DPI IND Services Pvt. Ltd.
6 Monate, Apr. 2022 - Sep. 2022
Physical Design-CAD Engineer
Anlage Infotech India Pvt. Ltd.
9 Monate, Aug. 2021 - Apr. 2022
Physical design engineer
Mobiveil pvt. ltd.
10 Monate, Nov. 2019 - Aug. 2020
Engineering trainee
RV-VLSI
Working on projects which involve Timing closure, floorplan, Powerplan, CTS, Routing and Physical verification
6 Monate, März 2017 - Aug. 2017
Research assistant
Fraunhofer-Institut für Elektronische Nanosysteme in Chemnitz (ENAS)
Calculation of Joule heating inside nano-sized geometries in COMSOL Multi-layered structure with varying electrical and thermal parameters Testing of different materials (YMO and BFO) for upcoming memory devices called as memristors
6 Monate, Aug. 2016 - Jan. 2017
Praktikum
Fraunhofer-Institut für Elektronische Nanosysteme in Chemnitz (ENAS)
Topic: Simulation of Joule heating for Ceramic material in COMSOL Multiphysics Creating 3D geometries, Analysing different material by changing the properties like electrical conductivity and thermal conductivity, Analysing and calculating joule heating in complex 3D geometries
6 Monate, Feb. 2016 - Juli 2016
Research assistant
Fraunhofer-Institut für Elektronische Nanosysteme in Chemnitz (ENAS)
Implementing the ideal solid model with the transfer of reference points from real solid model Various approaches for image reconstruction tried and tested Manually modify the ideal model to adjust according to the real model Proven method to transfer surface body in ANSYS
6 Monate, Aug. 2015 - Jan. 2016
Praktikum
Fraunhofer-Institut für Elektronische Nanosysteme in Chemnitz (ENAS)
Topic: 3D model reconstruction of DSLR images Capturing images of an object using DSLR, Converting multiple images into solid model, Applying boundary condition to the solid model, Analyis of the solid body.
Ausbildung von Nikhil Kulkarni
3 Jahre und 10 Monate, Nov. 2013 - Aug. 2017
Micro und nanotechnologie
Technische Universität Chemnitz
System design, Microsystem design, Reliability, Semiconductor physics Project: Circuit-simulation, Design and analysis of Current mode logic; Design procedure for bandgap reference topology (Mentor Graphics Design Architect IC)
3 Jahre und 11 Monate, Aug. 2008 - Juni 2012
Electronics Engineering
Faculty of Electronic Engineering, Pune University
VHDL, VLSI Design, Digital logic design, FPGA, Circuit design and Simulation, EDA, Network theory Project: VHDL code for Logic gates, Elevator, Finite state machine, Mealy and Moore circuit.
Sprachen
Deutsch
Fließend
Englisch
Muttersprache