Nishika Agrawal

Angestellt, Failure Analyses Engineer, Elmos Semiconductor AG

Dortmund, Deutschland

Über mich

I am a dedicated Electrical Engineering graduate student at the University of Stuttgart, passionate about semiconductor development process and analog circuit designing. My journey in academia has equipped me with a solid foundation in semiconductor device fabrication, device physics and mixed-signal circuit designing. I am now excited to transition from academia to industry and contribute my skills and knowledge to innovative projects.

Fähigkeiten und Kenntnisse

Circuit design
Hardware Development
Semiconductor device fabrication
Semiconductor Physics
device characterization
Clean Room
CMOS
Python
C++
Failure Mode and Effects Analysis
Semiconductor physics
Scanning Electron Microscopy
Focused Ion Beam
Analytical problem solving
Realibility engineer
Responsible
Team work
open minded
independent
Analytical skills

Werdegang

Berufserfahrung von Nishika Agrawal

  • Bis heute 2 Monate, seit Mai 2024

    Failure Analyses Engineer

    Elmos Semiconductor AG

    Conducting root cause analysis to diagnose issues in semiconductor devices. Utilizing advanced analytical techniques and tools, such as SEM, EDX, and FIB. Collaborating with cross-functional teams to improve product reliability and quality. Implementing corrective actions and preventive measures to mitigate future failures. Generating detailed failure analysis reports

  • 10 Monate, Juni 2023 - März 2024

    Master Thesis

    Institute of Large Area Microelectronics(IGM), University of Stuttgart

    •Title: “Analog to Digital Converter Circuits using Indium-Gallium-Zinc-Oxide (IGZO) Thin Film Transistors”. •Designed and simulated Flash ADC, Counter ADC and Sigma-Delta Modulator using IGZO TFTs. Designed circuit layout for fabrication masks. Fabricated ADCs on glass substrate. Created test setups for device and circuit characterization. •Skills: SPICE, K-Layout, Clean Room experience, TFT Device characterization.

  • 8 Monate, Okt. 2022 - Mai 2023

    Research Thesis

    Institute of Large Area Microelectronics(IGM), University of Stuttgart

    •Title: “Process Compatibility of IGZO TFT and a-Si TFT with a-Si Photodiodes”. •Developed a-Si photodiode and IGZO/a-Si TFT on the same glass substrate. Analyzed deposition, tempering, and etching conditions of the semiconductor materials and characterization of the fabricated devices. •Skills: K-Layout, Semiconductor Fabrication, Clean Room experience, Device and Layer Characterization.

  • 5 Monate, Nov. 2022 - März 2023

    Scientific Student Assistant

    Institute of Large Area Microelectronics(IGM), University of Stuttgart

  • 8 Monate, Dez. 2021 - Juli 2022

    Working Student

    Munit Solutions GmbH

    • Built test set up and characterization of energy meters, including current measurements of up to 1000A. Developed algorithm for automating energy meter measurement to extraction of real time data over Wi-Fi. • Skills: Python, Raspberry Pi.

  • 1 Jahr, Juni 2018 - Mai 2019

    Team Robocon: Technical Team Lead

    The Robotics Forum, VIT Pune

    Responsible for selection of the sensors and actuators needed, PCB designing, the microcontroller used to drive the system, power supply needed and automate the entire system. Ultrasound distance sensor, MPU-6050 Six-Axis (Gyro + Accelerometer), IR sensors were used for providing feedback to the system. Atmega 328p and Atmega 2560 were the two microcontrollers used for driving the system. The entire code was written in Embedded C language. Skills: Team Building · Robot Programming · Embedded C

  • 2 Monate, Juni 2018 - Juli 2018

    Research Assistant

    Korea Institute of Science and Technology

  • 1 Jahr, Juni 2017 - Mai 2018

    Team Robocon: Technical Team Member

    The Robotics Forum

    responsible for selection of the sensors and actuators needed. The microcontroller used to drive the system and automate the entire system. Interfacing driver circuits for used DC motors, server motors and pistons. Ultrasound distance sensor, Hall magnetic sensor, IR sensors were used for providing feedback to the system. Atmega 328p and Atmega 2560 were the two microcontrollers used for driving the system. The entire code was written in Embedded C language. Skills: Robotics · Micro Soldering · Embedded C

  • 2 Monate, Juli 2017 - Aug. 2017

    Summer Internship

    Vishwakarma Institute of Technology

Ausbildung von Nishika Agrawal

  • Bis heute 3 Jahre und 8 Monate, seit Nov. 2020

    Electrical Engineering

    Universität Stuttgart

    Focus on Semiconductor device physics and device fabrication. Analog Circuit Design and IC Layout.

  • 4 Jahre und 3 Monate, Aug. 2016 - Okt. 2020

    Electronics Engineering

    Vishwakarma Institute of Technology

    Grade: 9.19/10

Sprachen

  • Englisch

    Fließend

  • Deutsch

    Grundlagen

  • Hindi

    Muttersprache

Interessen

Painting
Yoga

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