Roberto Dossi

Technology Advisor for the whole team. Responsible for Programs and for all Technology Communities. Report to President Europe Region. o In charge for Technology support and Technology communities development: focus on Industry 4.0 and coordinate with all technical ecosystem (Smart Manufacturing ,Smart Transportation, Material, Test). o Strong networking covering complete ecosystem from material to OEM producers.

Develop innovative VCSEL and IoT sensors new systems. Lead senior managers Team. Report to VP engineering. o Production ramp up in Malaysia o Disruptive Technologies Development for new VCSEL and Sensor projects covering Competitors benchmark and long term roadmaps definition. o Responsible for just in time Technology and Products Transfer to Far East production.

Overall responsible for Package Roadmap and Wafer foundries interface. Focus on new System development and 3D Technology enabling and implementationin volume production

VP is a fast growing Company leader in the design, development and manufacturing of "turn key" lines and special equipments for the hose and cable Industry. The VP dynamic growth is due to the high technical background and built-in know how, with particular regard to the quality and manufacturing installed capacity. Responsible to support existing customers mainly in Guangdong and Hebei Regions

M&S CTM Engineer Europe Region Head

System portfolio enabling for NAND Flash memory (Special focus on Solid State Disk) Low cost subcontractor interface and enabling

Senior Staff Expert Responsible for Flash Package roadmap / strategy / specification Official interface for Through Silicon Vias technology New Assembly Technology Development owner for QFL (Bumping, RDL, high stacking Packages, etc)

Overall responsible for Flash Memory Package definition / development Provide complete Back End Flash Memory scenario / Find best BE partnerships BE subcontractor enabling / BE cost evaluation and optimization Drive products to production

Wireless package portfolio owner ( CSP, µBGA, MCP and TSOP) Special tasks on advanced 3D packages and SiP

Responsible for Multi Memory Products ( Flash + PSRAM Memories)

Responsible for test programs Official Business Unit interface for Hardware . Follow new Flash products production start

Responsible for Metrology and Calibration; Team leader Conductive thin film deposition group

Chinese Business development

Solar Panels, Semiconductor, High energy radiation damage