Dipl.-Ing. Jürgen Wölfl

Angestellt, Senior Quality Manager im Business Digital Industries, Siemens AG

Nürnberg, Deutschland

Über mich

Dynamic and ambitious Senior Quality Manager with over 20 years’ experience in Semiconductor and Industry Business Combination of R&D, Procurement and QM expertise with technical and disciplinary leadership of employees Comprehensive process and operational knowledge over the entire value chain e.g. Product Lifecycle Management, Supply Chain Management, Procurement Engineering, Manufacturing, Project Management and Service Business Experience in managing cross-country and cross-cultural projects/teams e.g. project manager Push Button, Six-Sigma Black Belt, , Lead audits & assessments worldwide, Business Representative for Asset Classification & Protection

Fähigkeiten und Kenntnisse

Quality Management
Project Management
Six Sigma Black Belt
Procurement Engineering
R&D
Planung
Qualitätskontrolle

Werdegang

Berufserfahrung von Jürgen Wölfl

  • Bis heute 12 Jahre und 5 Monate, seit Feb. 2012

    Senior Quality Manager im Business Digital Industries

    Siemens AG

    • Program manager for 30 Digitalization projects @ Quality Mgt. on Business level with focus on Quality in Operations, Supplier Quality Management, Computer Added Quality, Lean, etc. • Planning, coordination, and execution of worldwide Quality assessments & audits • Responsible for legal requirements and DI Business Representative Asset Classification Protection (ACP) – Optimization of the ACP process • Worldwide Non-Conformance Manager for Product-, Service- and Project business in DI

  • 3 Jahre und 4 Monate, Okt. 2008 - Jan. 2012

    Head of Program Management - Global value sourcing for R&D projects

    SIEMENS

    • Drive product portfolio update with business segment lead and CP “Leitkreis” • Feasibility studies/ for PLM projects worldwide (location, organization, know-how, budget, project org.) • Business Unit coordinator for Product Safety Committee (PSC) topics and member of the Siemens Product Safety Committee in U.S.A. • Additional to Head of Program Mgt. Project coordination for focus project “Push Button 3SU1” in SEAL, China • Implementation and execution of worldwide PLM project audits

  • 4 Jahre, Okt. 2004 - Sep. 2008

    Head of Technical Quality in R&D

    SIEMENS

    • Leading, planning, moderation and evaluation of preventive, development accompanying quality assurance (PLM-project –Reviews, FMEA, Risk analysis, Quality Gates) • R&D-coordinator for North America locations • Leading the Technical Quality (TQ) function in U.S.A., China and India • Execution of worldwide quality audits • Introduction of the “Zero Tolerance for Defects (ZTFD) quality strategy” in R&D and international locations • Six Sigma project “Lab transfer Batavia-Tucker” in U.S.A.

  • 3 Jahre und 5 Monate, Mai 2001 - Sep. 2004

    Procurement Engeneer

    SIEMENS

    • Procurement Engineering responsibility of the main products of the Electronic Works Amberg (EWA) for new and further development • Representation of purchasing interests of the Siemens wide Global Procurement Project • Representation of purchase at product launches • Cost structure analysis of existing products • Creation of benchmark and second–source considerations • Six Sigma project “Delivery quality membrane keypads” with a very high impact on manufacturing quality

  • 2 Jahre und 6 Monate, Nov. 1998 - Apr. 2001

    Process engineer Die-/ Wirebonding

    Infineon Technologies

    • Responsible for pilot line production Backend - Concept development for pilot lines worldwide - Upgrading the production lines - Duplication of pilot lines in Southeast Asia • Project leader GaAs-Transfer Regensburg- Villach • Conceptual design and implementation of a wafer inspection system for error analysis • Strong partner for customer complaints for product portfolio with Siemens VDO

  • 9 Monate, Feb. 1998 - Okt. 1998

    Service- and application engineer Wafer inspection systems

    Tokyo Seimitsu Company Limited

    • Engineering of application in the area of wafer probers & wafer saws for all worldwide semiconductor industry (Asia, America, Europe) • Product launch, optimization and implementation of wafer probers at Texas Instruments, Philips Semiconductors, Siemens Semiconductors

Ausbildung von Jürgen Wölfl

  • 9 Monate, Feb. 2006 - Okt. 2006

    Department of Electronics (DoE)

    Carleton University Ottawa

    CMOS

  • 4 Jahre und 5 Monate, Okt. 1993 - Feb. 1998

    Mikrosystemtechnik

    Fachhochschule Regensburg

    - Mechanik - Elektrotechnik - Optoelektronik - Physik

Sprachen

  • Deutsch

    -

  • Englisch

    Fließend

Interessen

Westernreiten
Alpines Skifahren
Bergwandern

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